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전체채용공고

본 채용공고는 마감되었습니다.
궁금하신 사항은 담당 컨설턴트에게 문의 바랍니다.
단말기 SW Layer1 엔지니어
회사정보
  • 회사설명

    외국계 유명 Chip Maker

  • 학력

    대졸이상

  • 직급

    [과장급]

  • 제출서류

    영문이력서, 자기소개서

  • 급여

    협의

  • 근무지

    서울

담당업무
- Applications support of modem and MMI software for GSM/GPRS/EDGE and 3G Mobile Handsets, also support of Evaluation and Development Systems and reference designs for same.
- Responsible for assisting customers in all phases of development from concept to production and will involve debugging and correcting customer issues with handset software (MMI and Layer 1), design and/or debug of embedded systems software, and system integration.
- Duties will also include managing relationships with customers at the technical/ engineering level, as well as significant travel (25% or more) to resolve field issues.
- Experience with cellular telephone protocol stack software, IOT, handset qualification, 16- and 32-bit microcontrollers, DSPs, C and Assembly programming and embedded systems development are required.
- Experience in project management, customer interface/support, and development of mobile handsets is preferred.
경력 및 자격요건
- 4-7 years’ experience with a BS/MS degree in Electrical Engineering, Computer Science, or related field.
- Customer support experience preferred; good verbal and written communication skills in English.
- Demonstrated experience, understanding of, and ability to code GSM L1 and/or MMI SW, and experience in operator qualification of handsets.
기타
- 원서 마감후 1차(서류) 합격자에 한하여 개별연락
- 이력서에 연락처, 희망연봉 게재
- 해외여행에 결격 사유가 없는 자

담당 컨설턴트
전상아 

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