• Develop, optimize and troubleshoot advanced packaging processes in collaboration with our
customers
• Troubleshooting and repairing of semiconductor packaging equipment
• Serve as a key technical interface to customers
• Review new applications and create requests for application-specific tooling
• Preparation of internal summary reports and customer presentations in English
• Detailed analysis of process data and log files to guide process optimization
• Willingness to travel internationally about 10%, mostly to Singapore for training, but also US
and other locations
==============================================
1. 근무지_파주
2. 숙소 :
1) 싱글 - 기숙사 제공
2) 부양가족 있는 경우 - 월세 지원 (월 95만)
3) 서울 또는 타 지역에서 출퇴근 경우 - 유류비 지원
3. 기타 : 격오지 수당 월 30만원 이상으로 협의 중
경력 및 자격요건
시니어 엔지니어_경력5년이상
주니어 엔지니어_경력3년이하
• Strong, demonstrated aptitude and deep understanding of highly advanced machinery
• Experience with flip chip, die attach or thermocompression bonding highly preferred
• Experience troubleshooting advanced machinery, use of oscilloscopes, etc.
• Experience with servo control systems, vision systems, material handling systems a plus
• Strong aptitude in Excel
• Experience with data analysis methods, such as JMP, Minitab, Matlab or Python, a plus
• Experience with data and process waveform analysis a strong plus
• Knowledge of MS Office suite: Excel, Word, Power Point, Outlook
• Good English skills, both written and verbal
전공_ 전기/전자공학 관련 우대
* 영문이력서(2장정도) 제출 요망!
기타
- 원서 마감후 1차(서류) 합격자에 한하여 개별연락
- 이력서에 연락처, 희망연봉 게재
- 해외여행에 결격 사유가 없는 자
담당업무
입사지원
내메일로 보내기
돌아가기
02-6281-5086
cjh@nterway.com
