-. Needs to have higher technical experience especially Digital, Mixed signal and Memory testing as well as
-. Trouble shooting experience. Prefer to man who knows RF testing.
-. Wafer sort process and load board design experience needed
-. Well understanding for test production test flow including backend process.
경력 및 자격요건
- 반도체 Packaging Test Engineering 경력자 우대
- 영어 가능자 우대